Glossary - alphabet order - "L"
Abbreviation for Low Voltage Differential Signaling. This type of circuit is used for serial transfers of data via low-amplitude differential signals. Since they can be applied for high frequencies.
|LVDS output definition||Output voltage level comparison|
Leaf type crystal chip
This name makes a distinction based on manufacturing methods used for tuning fork crystal chips. It refers to a type of crystal chip that has a tuning fork shape that is formed by a photolithography processing. The name "leaf type" comes from the fact that the thin crystal plates are used in the photolithography. See "photolithography processing".
Reference: Photolithography processing
Structure of ceramic package
This refers to the lid on a ceramic package. The lid can be made of metal, ceramic, glass, or other material, and various lid sealing methods can be used.
This is a crystal oscillation circuit's actual capacitance (series equivalent electrostatic capacitance) from the perspective of the crystal unit's two terminals. The oscillation output frequency is determined based on this capacitance. (See CL in the relevant figure at right).
|Relation be tween crystal unit and crystal oscillation circuit||Tuning fork crystal unit's load capacitance-frequency characteristics|
Long term jitter
This refers to accumulated jitter. See "jitter".
Low- & medium-frequency crystal unit
This refers to a crystal unit that operates in the kHz band of oscillation frequency. Tuning fork crystal chips are usually used in this frequency band. Generally, frequencies below 100 kHz are called low frequencies and those in the 100 kHz to 1 MHz band are called medium frequencies. At Epson, "low frequency" refers only to the widely used 32.768 kHz frequency while other frequencies in the kHz band are all referred to as medium frequencies. Epson products of this type are found in the FC Series and MC Series.
Reference: Frequency band