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RX-8571LC (Low Current Consumption I2C-Bus Interface Real Time Clock Module)
- Built-in frequency adjusted 32.768kHz crystal unit.
- Interface Type
I2C-Bus Interface(400kHz)
- Operating voltage range
1.6V to 5.5V
- Wide voltage for timekeeping
1.3V to 5.5V
- Low backup current
220nA / 3V(Typ.)
- 32.768kHz frequency output functionC-MOS output With Control Pin
- Built in user RAM
128bit(8bit x 16, SRAM)
- The various functions include full calendar, alarm, timer,etc.
(Long-running timer : 65535 hours)
Block diagram
Overview
- 32.768kHz frequency output function
- FOE pin enable output on/off control.
- Output frequency can be selected as 32.768kHz, 1024Hz, 1Hz.
- Timer function
- Timer function can be set up between 1/4096second and 65535hours.
- Timing period are 1h, 1min, 64Hz, 4096Hz.
- It is recorded automatically to TF-bit at the time of
event occurs, and possible to output with /IRQ pin output.
- Alarm function
- Alarm function can be set to day of week, day, hour, or minute.
- It is recorded automatically to AF-bit at the time of
event occurs, and possible to output with /IRQ pin output.
- User RAM
- 128bit (8bit x 16,SRAM)
Specifications *Refer to application manual for details.
Recommend Operating Conditions
Item | Symbol | Condition | Min. | Typ. | Max. | Unit |
---|---|---|---|---|---|---|
Power voltage | VDD | - | 1.6 | 3.0 | 5.5 | V |
Clock voltage | VCLK | - | 1.3 | 3.0 | 5.5 | V |
Operating temperature | TOPR | - | -40 | +25 | +85 | °C |
Frequency characteristics
Item | Symbol | Condition | Rating | Unit |
---|---|---|---|---|
Frequency tolerance | Δ f/f | Ta=+25°C VDD=3.0V |
5±23 * | ×10-6 |
Oscillation start up time | tSTA | Ta=+25°C VDD=1.6V |
1 Max. | s |
* Please ask for tighter tolerance.( Equivalent to ±1 minute of monthly deviation )
Current consumption characteristics
Item | Symbol | Conditions | Min. | Typ. | Max. | Unit |
---|---|---|---|---|---|---|
Current Consumption |
lDD | FOE=/BM="L" FOUT=OFF /IRQ=OFF VDD=3.0V Ta=+25°C |
- | 220 | 400 | nA |
FOE=/BM="L" FOUT=OFF /IRQ=OFF VDD =3.0V Ta= -40°C to +85°C |
- | - | 550 | nA |
Terminal connection / External dimensions
(Unit: mm)
Stop using the glue
Any glue must never use it after soldering LC-package to a circuit board.
This product has glass on the back side of a package.
When glue invasions between circuit board side and glass side, then glass cracks by thermal expansion of glue.
In this case a crystal oscillation stops.Consider glue abolition or glue do not touch to LC-package
Footprint (Recommended)
(Unit: mm)
To maintain stable operation, provide a 0.1uF by-pass capacitor
at a location as near as possible to the power source terminal of the crystal product (between Vcc - GND).